Plating solution for electroplating Ni/graphene compound heat conduction film on surface of substrate

The invention discloses a plating solution for electroplating a Ni/graphene compound heat conduction film on the surface of a substrate. Each liter of the plating solution comprises the following components by weight: 230g-380g of nickel salt, 30g-40g of boric acid, 0.1g-10g of a stress subduction agent, 0.1g-2g of graphene, 0.01g-0.1g of a dispersing agent and 0.05g-0.4g of a surfactant. According to the plating solution, by adding the surfactant, the wettability between the surface of the substrate and the plating solution is effectively improved; by adding the stress subduction agent, the stress among plating layers is effectively reduced; by virtue of a proper amount of graphene and dispersing agent, the Ni/graphene compound heat conduction film with the thickness of 10-50mu m can be formed on the surface of the substrate after plating, the film has high binding force with the substrate, and graphene is uniformly dispersed in the film, so that the heat conductivity coefficient of a material obtained after plating is greatly increased relative to that of the substrate.