3D Heterogeneous Integration Based on Through X via Technology

The demand for miniaturization, high integration and high reliability of electronic equipment has prompted the microwave circuit to stack microwave multi-chip modules with different functions in the Z direction to form vertically integrated 3D heterogeneous integrated modules. This paper introduces the concept, structure and application environment of 3D heterogeneous integrated circuit based on through the X via technology, and tries out prototypes of 3D heterogeneous integrated process to provide new micro-system design and IP core design solution.