Low die apparatus for semiconductor molding apparatus, semiconductor package and method for fabricating the same

Provided is a low die apparatus for a semiconductor molding apparatus. The low die apparatus for a semiconductor molding apparatus includes a mounting surface for mounting circuit substrate chips including through holes, and window patterns extended in a first direction in the lower part of the circuit substrate chip and arranged with the through hole formed on each circuit substrate chip. The window pattern includes a first path pattern having a first width, and a second path pattern having a second width.