Lead-free solder alloy, bonding members and a manufacturing method, and electronic components

Adhesion using free solder and it lead can reduce the occurrence of voids, provided the bonding strength, excellent formability connecting member. Sn: 0.1 to 3%, and / or, Bi: 0.1 to 2%, has with balance of In and inevitable impurities, lead-free solder alloy which is effective in suppressing the occurrence of voids during soldering it is. And melting the lead-free solder alloy, the metal substrate is dipped, formed by applying ultrasonic vibration to the lead-free solder alloy which is molten and the metal substrate, the surface of the metal substrate, a lead-free solder alloy layer to the connecting member. Through the connecting member is soldered by reflowing heating the heat sink and the package in the presence of a flux.