Fabricating method and apparatus of Semiconductor device

The method of producing a semiconductor device and an apparatus are provided. A method for fabricating a semiconductor device obtains the data (raw data) with the first to measure the overlay of the semiconductor wafer of claim 1 Eilat (lot), and generating a regression equation based on the data in the first, and the regression equation based on the coefficients in a second sort of a semiconductor wafer of Eilat and, by measuring the overlay of a semiconductor wafer of the 2 lots of the alignment obtained data to the second, and correcting the regression equation based on the data in the second but include, but correcting the regression, the regression equation for the initial expression, separated by a residual expression obtained by subtracting the initial expression the regression equation, and the said initial expression on the basis of data to the second 1 regression analysis by correcting the coefficients of the initial expression and in a second regression by applying the coefficients of the initial equation for the regression involves correcting the coefficients of the residual expression.