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Elucidation of saw marks flattening mechanism in Si etching using HF/HNO 3
Elucidation of saw marks flattening mechanism in Si etching using HF/HNO 3
2019
Takashi Fukatani
Takashi Oinoue
Suguru Saito
Yoshiya Hagimoto
Hayato Iwamoto
Keywords:
Etching
Flattening
Optoelectronics
Materials science
Correction
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