Dual side cooling package DSOP Advance: Thermal conductance innovation for Power-MOSFET

A new MOSFET package called DSOP Advance (Dual Side Cooling SOP 5x6mm) has been developed. That device features an innovative thermal conductance with dual side cooling realized by using a Copper (Cu) plate on the bottom and on the top package surface. Compared with the single side cooling package structure, the thermal resistance (Rth) could be reduced by 26% and the avalanche energy could increase as well due to the thermal conductance improvement. Also, a 25% reduction of the package electrical resistance could be achieved, due to the conductive path cross-sectional area increase.