High Heat Flux Removal Using Optimized Microchannel Heat Sink

In this paper, we report on a silicon-based compact micro channel heat sink that enables high heat flux dissipation. Using advanced CMOS compatible silicon fabrication, high aspect ratio micro channels, 32 μm wide and 160 μm deep were realized. The heat sink was interfaced to a small 5.0 mm × 5.0 mm silicon-based thermal test chip. A very low thermal contact resistance between the heat sink and the heater die was achieved using an optimized Cu/Sn-Au interface. As a result, a low total thermal resistance of 0.36 K/W (9mm 2 K/W) at the pump power of about 2 W was achieved on the assembled device. The design, fabrication, measurements on cooling performance and 3D modelling of the device are included in this paper.