Thermal Analysis of xFD DRAM Packages Through Simulation and Experimental Validation

The design optimization for thermal management of systems relies heavily on accurate thermal models of the individual components. Invensas is developing new packaging concepts that provide enhanced and reliable performance electrically, thermally and mechanically. These development efforts use predictive finite element analysis to drive the optimization of package design for improved thermo-mechanical strain and thermal management. Therefore, it is important to validate such models through rigorous experimental thermal measurements. This work represents the 2nd half of our effort in the area of multi-die face-down stack thermal analysis. As was presented last year for the dual die face-down stack analysis, we will present details of our quad die face-down package design, assembly and the thermal test protocols. We will outline our methodologies for measuring thermal performance and achieving tight tolerances in the experimental apparatus as well as guidelines for making appropriate assumptions for associa...