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The improvement of copper interconnect electromigration resistance by cap/dielectric interface treat
The improvement of copper interconnect electromigration resistance by cap/dielectric interface treat
2004
Ming-Hui Lin
Yu-Ling Lin
Juming Chen
Ching Tsai
Michael Yeh
Chung Liu
Shih Hsu
C.C. Wang
Sheng Yao
Kuo-Ping Chang
Karen Su
Moh Yin Chang
Tahui Wang
Keywords:
Electromigration
Copper interconnect
Copper
Dielectric
Ceramic materials
Materials science
Composite material
Correction
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