Optimization of process parameters for laser soldering of surface mounted devices

The authors present characteristics of laser soldering the explain their importance for industrial application. The dependence of solder joint quality on the laser beam parameter settings as well as on the properties of the solder and the materials to be joined is discussed. A simple thermal model is used to describe the influence of material properties on the temperature within the solder joint. Temperature courses recorded during soldering processes while applying different parameter settings are analyzed. >