Write Current Reduction in Transition Metal Oxide Based Resistance-Change Memory

while still retaining a selective switch (transistor or diode) asthe data storage element. Thus for high-density applications,crossbar structures are ideal, whereas for non-volatility, resis-tance-change materials showthe best promise. In orderto rea-lize the fabrication of universal memory elements, it is im-perative to develop a class of materials and structures thatcombine robust processibility, strong scalability, and rapidprogramming speed with non-volatility and low power con-sumption. In our work, we have focused on defining just thestorage node portion of the devices, which utilize the resis-tance change within the film to store information via two dif-ferent stable resistance states. Here, we have attempted to de-termine the properties of such structures and to study themechanisms behind resistance RAM (RRAM) storage. OurTi-doped (0.1 wt %) NiO samples deposited at room temper-ature show favorable node characteristics such as the lowestwrite current reported thus far for a unipolar switching resis-tance-change-based device (ca. 10 lA). In addition, the pro-gramming speed is comparable to the write time of SRAM(10 ns). By combining this node element with an appropriateselect switch, such as a high-performance diode, a thresholddevice, or a two-terminal non-ohmic device, it becomes possi-ble to fabricate high-density universal memory.Indeed, the fabrication of universal memory as the nextgeneration of non-volatile memory is the logical goal for re-search in this field. In comparison to Flash and dynamicRAM (DRAM), which are the current industry standards,next generation memories must combine the non-volatility ofFlash with the high-speed performance of SRAM.