Light- or heat-curing method and curable resin composition

The purpose of the present invention is to provide a light- or heat-curing method whereby a cured material (crosslinked material/resin) can be obtained even when a large amount of a filler is included, and to provide a curable resin composition used in the curing method. The present invention relates to a light- or heat-curing method and a curable resin composition used in the curing method, the curing method including: a step 1 for obtaining a condensate having Si-O-Al and/or Si-O-Si constituent units, obtained from a silane derived from a silane coupling agent having a mercapto group and aluminum derived from (E) an aluminum alkoxide, from (A) a compound comprising a salt of a carboxylic acid and an amine and having a carbonyl group for generating a radical and a carboxylate group for decarboxylating and generating a base by light irradiation or heating, (B) an aluminum alkoxide, (C) a silane coupling agent having a mercapto group, and (D) water; and a step 2 for reacting the condensate (E), (H) a compound having two or more polymerizable unsaturated groups, and (I) a filler under a condition of light irradiation or heating.