Speed and depth effect of the dipping process for microelectronics packaging

Abstract In order to understand the dipping process, a dipping experimental bed was integrated, dipping speed and dipping depth can be adjusted flexibly by motion controller of the bed, and the dipping process was recorded quickly by high-speed camera system. It was found that low rising speeds result in a large drop remained between the bumps; the drop is effectively removed when the rising speed is 1.6 cm/s or more, and the glue quantity of dipping bumps decreases with increase in the rising speed. Deep dipping depth also leads to the drop, and the glue quantity of dipping bumps increases with increase in the dipping depth. If the dipping depth is 50 μm, the drop also does not happen under the condition of 0.8 cm/s low rising speed. Although the dipping depth is set to 150 μm, the drop can also be removed by using 3.2 cm/s high rising speed. It shows the matching relationship between dipping speed and dipping depth, and glue quantity of dipping bumps can be roughly expressed as a function of the speed and the depth.