A method of manufacturing an electronic device, the electronic device and electronics

2011 
Object of the present invention is equipped with the electronic part substrate is mounted, the external electrodes opposite side of the mounted side of the electronic component of the substrate, and an electronic device through electrode with the substrate welding, make sure that the electronic component and the external electrode turned on. The electronic device according to the present invention comprises: a substrate (10); through the base (10), and is removed through the electrode insulating material of the end face (21) by milling; a circuit pattern (30) formed in one end face of the through electrode (21) , an electronic component (40) via the internal wiring and the circuit pattern (30) formed on the (31) is provided; at the side opposite side of the substrate (10) is provided with an electronic component (40) and forming the through electrode another end surface (21) is connected to the electrode patterns (60) and the outer electrode (61) formed on the electrode pattern (60); and a base substrate protection engage the electronic component (40) (10) cover (50).
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []