Components module for high temperature applications and methods of manufacturing such devices module

The invention relates to a component module (20) for high-temperature applications and a method for its preparation. The module components of the invention has at least: a base plate (12), two on both sides metal-coated substrates (1, 2); wherein the lower substrate (1) is fixed on the base plate, at least two micro-structured high-temperature components (3) disposed between the two substrates (1, 2) and via solder layers (6) with the metal coatings (1.3, 2.2) of the substrates are contacted, partially surrounding a Moldkorper (14) which is arranged on the base plate (12) and the substrates (1, 2) and high-temperature components (3) completely and a connecting means (8, 9), wherein formed between the substrates and the structural elements (3) intermediate structures (16) are completely filled with the molding compound of the Moldkorpers (14), comprising: - a glass transition temperature greater than / equal to 190 ° C, - a processing viscosity 5-15 Pas, - between 80 and 90 percent by weight of spherical filler, mineral filler bodies with diameters primarily in the range between 20 and 50 microns.