FLIP-CHIP MODULESFORMILLIMETER-WAVE SENSORAPPLICATIONS

Inthis paperthedesign ofaW-band flip-chip (FC)sensor module ispresented. Themodule incorporates twoMMICs,avoltage controlled oscillator andatransceiver/receiver. Coplanar waveguides areusedon theMMICsandthesubstrate. TheFCinterconnection isbased onathermocompression process withgold bumps. Through several experiments, thebehavior oftheMMICsrelated todifferent packaging conditions isinvestigated. Byminimizing parasitic effects, theflip-chip approach proved tobeveryattractive for assembling large MMICswith multiple integratedfunctions.