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Micro-Heat pipe Design Study for 3d Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method
Micro-Heat pipe Design Study for 3d Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method
2018
Yue Ma
Shirazy Mrs
Struss Q
Perceval Coudrain
Jean-Philippe Colonna
A. Souifi
Luc G. Fréchette
Gontrand C
Keywords:
Heat pipe
Finite element method
Microelectronics
Mechanical engineering
Materials science
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