Polishing apparatus polishing head and polishing processes

Polishing apparatus comprising: a polishing plate provided with an abrasive cloth; a chuck for holding a polishing target material in order to bring the polishing target material with the abrasive cloth in contact; and a cylinder disposed in a perimeter of the chuck retaining ring, wherein the polishing target material is polished by the abrasive cloth by a relative movement of the polishing plate and the chuck, characterized in that the retaining ring and the chuck can be moved independently of each other in vibration.