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Flip-chip interconnection technology for packaging of VLSI operated in liquid nitrogen
Flip-chip interconnection technology for packaging of VLSI operated in liquid nitrogen
1991
K. Hashimoto
Masayuki Ochiai
Kazuaki Karasawa
Teru Nakanishi
Keywords:
Liquid nitrogen
Mathematics
Very-large-scale integration
Integrated circuit
Electrical engineering
Flip chip
Interconnection
Encapsulation (computer programming)
cryogenic temperature
Silicon
Correction
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