A method of cutting a laminate with a laser and laminate

A method for cutting a first substrate and a second substrate comprising the laminate, with the following steps: Forming at least one groove (16) in a substrate (14) of the first substrate (12) and the second substrate (14), Laminating the at least one groove (16) having a substrate (14) on the other substrate (12), such that the at least one groove (16) the other substrate in question (12) faces, and irradiating a laser beam (18) on the first substrate (12) and the second substrate (14) along the at least one groove (16) from the side of a substrate in question (14) with the at least one groove (16) in such a way that the first substrate (12) and the second substrate (14) comprising laminate (10) is cut.