Topology optimization of time-transient heat conduction for thermo-optic silicon modulators

Abstract An optimization method is presented to enhance the time-transient thermal response of a thermo-optic silicon modulator. For the development of efficient opto-electronic devices, fast thermal response in a compact form factor is crucial to increasing modulator performance. Thus, to improve response, the layout of the modulator device is modified and tailored by structural topology optimization. The optimization approach considers the transient thermal response of the device with an adjoint sensitivity analysis of the transient system. A detailed design example for a silicon waveguide with an over-clad metal heater is provided, and results highlight a faster modulator temperature rise response with reduced out-of-plane length. The method is broadly applicable to a range of thermo-optic devices involving waveguides for next-generation sensors.