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パワーエレクトロニクス応用のためのSn‐3.0Ag‐0.5Cu/Ni/CuとAu‐20Sn/Ni/Cuはんだ継手の界面反応と機械的強度【Powered by NICT】
パワーエレクトロニクス応用のためのSn‐3.0Ag‐0.5Cu/Ni/CuとAu‐20Sn/Ni/Cuはんだ継手の界面反応と機械的強度【Powered by NICT】
2017
Lee Byung Suk
Ko Yong-Ho
Bang Jung-Hwan
Lee Chang-Woo
Yoo Sehoon
Kim Jun-Ki
Yoon Jeong-Won
Keywords:
Engineering
Electronic engineering
Mechanical engineering
Engineering physics
Reliability engineering
Correction
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