The mounting board

PROBLEM TO BE SOLVED: To prevent a waste board region separated from a mother board from becoming a harmful mixed waste contaminating the environment by a method wherein solder used in a soldering operation is attached to board arrangement members such as lands which are solder wettable and arranged on the mother board composed of a useful board region used for a product and a waste board region which is disused. SOLUTION: A mounting board 11 is equipped with a mother board composed of a useful board region A used for a product and a waste board region B which is disused and subjected to a soldering operation making its surface come into contact with solder and lands (board arrangement member) 3 whose surfaces are solder wettable and which are arranged on the soldering surface of the mother board 2, where the lands 3 are arranged on a first waste board region B1 (non-contact part) out of the waste board region B which is not brought into contact with solder in a soldering operation or on the useful board region A or on the first waste board region B1 and the useful board region A.