An imaging head module and a method of making the camera module

The present invention provides a method of making the camera module and camera module, the method comprising: making a first predetermined thickness and predetermined material of the substrate, a first opening region formed on the surface of the substrate with a recess and determining the image sensor die is embedded in the groove, the second region does not overlap a second region of a predetermined thickness unity attached flexible printed circuit board on a surface of the substrate with the first region, and the image sensor die the pin is connected to the flexible printed circuit board, the final lens assembly is mounted on the substrate, so that the image sensor die is capable of receiving external light passing through the lens assembly. It can be seen on the substrate provided with a recess, and the recess may be such that the overall thickness of the image sensor die and the substrate is reduced to achieve a light and thin camera module.