Clear resin molded body and method of producing the
2010
This invention is a clear resin molded body having a high heat resistance and can be used in reflow soldering process using Pb-free solder material having a high transparency and used for an optical member and can be easily manufactured; and also a process for its preparation to. A clear resin molded body includes a molded article of a resin composition composed of a fluorine resin with carbon-hydrogen bonds, wherein the resin composition by irradiation of the molded body with ionizing radiation at least once in an atmosphere at a temperature which is lower than the melting point is the fluorine resin, and at least one cross-linked in an atmosphere at a temperature which is equal to or higher than the melting point of the fluororesin. The method generates the clear resin molded body.
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