A method and apparatus for forming parts and assembly microscale

The invention discloses a method and a device for forming and assembling a microscale part, and is applied to the forming and the assembly of micro-precision parts such as integrated circuits and microelectronic products. According to the method, flat top type strong pulse laser illuminates on a restraint layer to form pressure wave to impact a target and make the target locally and rapidly expanded; a micro-blanking material flying at a high speed is obtained under the action of a cutting mould; the micro-blanking material flies at a high speed and then hits against a part to be assembled, so the surface appearance of the part to be assembled is copied and microscale forming is formed; and the speed of the formed microscale part is reduced to zero, the formed microscale part is attached onto the upper surface of the part and then assembled, and the positioning and the installation of the microscale part are performed, so the integration of the forming and the assembly of the microscale part is realized. By the method, the forming and the assembly of the microscale part can be realized simultaneously; therefore, the method is a modern micro-device making method which integrates the processing and the assembly of the microscale part, and has the processing characteristics of high flexibility and high efficiency. Moreover, rapid industrialized production in a large scale is easyto realize.