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A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film
A Novel Composite Bump Design for Chip-on-Glass Package Using Non-Conductive Adhesive Film
2009
Pao-Yun Tang
Wei-Hao Sun
Kei-Hsiung Yang
Keywords:
Chip
Adhesive
Composite number
Electrical conductor
Composite material
Materials science
chip on glass
Correction
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