Method for enhancing pattern uniformity

The invention relates to a method for enhancing pattern uniformity, suitable for a substrate comprising a pattern concentration region and a pattern quasi-vacant region. The substrate is sequentiallyformed with a barrier layer and a bottom antireflective layer. The method comprises: first forming a patterned photo-resistant layer; the patterned photo-resistant layer comprises a first photo-resistant pattern in the pattern concentration region, and a second photo-resistant pattern in the pattern quasi-vacant region, wherein the size of the second photo-resistant pattern is larger than the sizeof the first photo-resistant pattern; then carrying the first clipping step to realize micro-patterned process on the photo-resistant layer, meanwhile, removing part of the bottom antireflective layer by using the patterned photo-resistant layer as a covering shield; then carrying out the second clipping step to realize micro-pattern process on the photo-resistant layer and the bottom antireflective layer simultaneously, and minimizing the size differences between the second photo-resistant pattern and the first photo-resistant pattern. The invention can be used for enhancing the pattern uniformity.