Present Research Status of Low-expansion and High-thermoconductivity SiC_p/Al Composite Materials for Electronic Packaging

With the rapid development of microelectronic and semiconductor technology,the density of electronic packaging increases quickly,which results in the higher request to the materials.SiCp/Al composites received extensive attention because of its superior properties such as low thermal expansion,high thermal conductivity and low density.As electronic packaging materials,SiCp/Al composite materials have gained actual applications in aerospace,optics and instruments.This paper introduced the research and development of aluminum reinforced with silicon carbide particles composites and discussed several manufacturing methods,such as powder metallurgy method,spray deposition method,stir casting method,pressureless infiltration method and pressure casting method.In addition,merits and defects of variety of fabrication used were analyzed and the directions for the future research and development of the technology were prospected.