Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder

Takashi Hisada,Toyohiro Aoki,Eiji Nakamura,Sayuri Kohara,Hiroyuki Mori

Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder

2019

Takashi Hisada
Toyohiro Aoki
Eiji Nakamura
Sayuri Kohara
Hiroyuki Mori

Abstract IBM has developed and has been enhancing the injection molded solder (IMS) technology as an advanced solder bumping technology with flexible solder alloy composition applicable even to fin...

Keywords:

Soldering
Flip chip
melting temperature
solder alloy
Bumping
Materials science
Composite material

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