Potential technologies for next generation defect inspection

• ISMI can provide industry with unique challenging test wafers down to 13nm and methods for defect detection, characterization and yield enhancement, collaborating with academia and suppliers. • As bright-field detection in the far-field loses its ability to discriminate defect of interest beyond 22 nm node, new alternatives must be explored. • RPM and SHI are introduced as examples of our candidate technologies for next generation inspection.