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具有Ni-Cr结合涂覆层无粘结剂的铜——聚酰亚胺基板
具有Ni-Cr结合涂覆层无粘结剂的铜——聚酰亚胺基板
2003
Tad
Bergstresser
Rocky
Hilburn
H.Haplam
R.Le
dingzhilian
聚酰亚胺基板上的无粘结剂的铜将普遍应用于精细导线和高密度电子互连的领域.医疗、硬盘驱动和COF(chip on
flex
)应用上往往要求线宽/间距(L/S)为50μm(2mil)或更精细.
Keywords:
Embedded system
Chip
FLEX
Computer science
Computer hardware
Materials science
Correction
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