Polyimide and platinum containing polyimide thin films obtained by vapour deposition polymerization; effects of thermal treatments

Abstract PMDA-ODA polyimide thin films were deposited by vapour deposition polymerization on different substrates. FTIR spectroscopy confirmed the polyimidic nature of the deposited coatings after curing in argon at 250 °C. Platinum containing polyimide coatings were obtained by co-evaporation of PMDA and ODA monomers and (1,5-cyclooctadiene)platinum(II) chloride. After curing the films consist of Pt particles embedded in a polyimidic matrix, as demonstrated by FTIR and RBS analysis. Cured Pt containing films were further thermally treated in hydrogen. After these treatments we observed a great film thickness reduction (from 40% to 95%), depending on the treatment temperature and time, tentatively attributed to the cracking catalytic action of platinum.