Process for producing an electrolytic copper foil roughened surface

The invention relates to a process for manufacturing smooth surface roughened electrolytic copper foil, which comprises a step of pickling, a step of primary smooth surface roughening, a step of secondary smooth surface roughening, a step of primary smooth surface curing, a step of secondary smooth surface curing, a step of double-size anti-oxidization treatment, a step of double side passivation and a step of smooth surface coupling agent treatment, which are accomplished continuously on the same production line. Compared with the prior art, the smooth surface roughened electric copper foil manufactured by the process for manufacturing the smooth surface roughened electrolytic copper foil has the advantages of short copper teeth, easy etching, and high impedance controllability. When the copper foil is used in production of downstream products, the needs of blackening micro corrosion and toughening treatment are obviated, so the manufacturing process is shortened, and the short circuit rate and open circuit rate are lowered; meanwhile, the copper foil manufactured by the process has the same quality as the conventional high-precision or double-side toughened electrolytic copper foil, is produced at low cost and is more suitable for manufacturing the inner layers of high-precision multilayer plates and high-density fine line printed circuit boards (PCBs).