ofa power modulededicated tohightemperature applications

Inavionic area,thetrend istoa growing use ofpower electronics systems. Inthis context, we will presentresults concerning testvehicles (power modules) inorder toimprove a device assembly technology dedicated tobelocated "ontheengine", inharsh operating conditions withthermal cycling from-50°Cto200°Cintheworstcase.Thepaperfocuses on failure modesobserved underhigh operating temperature andhightemperature cycles, especially ceramic cracks, conchoidal fracture underthecopperlead-frame andsolder crack initiation. Numerical thermo-mechanical simulations of theassembly allow tounderstand theorigin ofthefailures andtoimprove theassembly lifetime under suchsevereoperating conditions. Theobjectives ofthestudy aretoassessthelifetime behaviour of these modules towards bothhigh temperature andthermal cycling effects.