Silicon optical benches for next generation optical packaging: going vertical or horizontal?

In this paper, we present an alternative silicon bench approach using a vertical stacking method to improve upon the ubiquitous TO-can design. In the proposed design, the beam propagates vertically through several layers of micro-machined silicon pieces which perform substrate, RF feedthrough, hermetic sealing and optical alignment functions. Our packaging architecture includes a MEMS (micro-electro-mechanical system) actuation layer to actively align a lens to a single mode connector. Executed at the final assembly step, this MEMS alignment alleviates the need for expensive laser welding alignment stations.