An arrangement for fastening a component

The present invention provides an apparatus 1 for mounting a component 2, in particular of an electronic power device 2, at least one carrier 3, 7, wherein a brazing material 5 is provided on a solder joint 4 on the respective carrier 3, 7 zugewanndten surface of the component 2 wherein at least a recess 9 in which the solder joint 4 facing surface of the respective carrier 3, 7 is provided for receiving a Lotmitteluberschusses or a Lotbegrenzung.