Wiring board, a semiconductor device and a method for their preparation

In the present invention, an insulating substrate, a wiring provided on one surface sides of the insulating substrate, and a conductive member embedded in the insulating base within the material, one end of the conductive member is an insulating substrate surface and exposed to connect to the wiring, the other end wiring board embedded in the insulating substrate, a semiconductor device using a wiring substrate, and methods for their preparation are provided.