Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Abstract High melting point Ni 3 Sn 4 joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8 s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni 3 Sn 4 grains with the average diameter of 2 μm, perform the average shear strength of 26.7 MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni 3 Sn 4 joints.