Business Intelligence Services bei T-Mobile Deutschland: Service Level Agreements und servicebezogenes Datenqualitätsmanagement zur kundengerechten Leistungserbringung.

A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.