Surface treatment agent for copper or copper alloy, and use thereof

The present invention provides the following: a surface treatment agent and surface treatment method by which it is possible to form, on the surface of copper or a copper alloy, a chemical coating film having excellent oxidation resistance and corrosion resistance; an electronic component and printed wiring board having a chemical coating film formed on the surface of copper or a copper alloy by using the surface treatment agent; a transparent electrode substrate provided with the printed wiring board; and a touch panel provided with the transparent electrode substrate. The present invention uses a surface treatment agent for copper or a copper alloy, which contains ammonia and a tetrazole compound represented by chemical formula (I) and/or a salt thereof. (In the formula, R 1 denotes a straight chain, branched chain or cyclic alkyl group having 1-3 carbon atoms.)