GOLD (Au)-DISPERSED COPPER WIRE FOR BALL BONDING

The present invention provides gold (Au) dispersed copper wire for ball bonding which can form a stable molten solder ball to solve the problem that the FAB of the mass production line causes instability of the formation of the molten solder ball. The gold (Au) dispersion copper wire for ball bonding according to the present invention is characterized in that it is formed of a palladium (Pd) coating layer on a core material composed of a copper alloy having a purity of copper (Cu) of 99.9% by mass or more (Au) cladding copper wire with a diameter of 10-25 microns and a theoretical film thickness of 0.1 nm (nm) or more for the chemical analysis of the gold (Au) The distribution of gold (Au) obtained by the surface analysis of the electron microprojector (EPMA) is such that the gold (Au) fine particles are distributed on the palladium (Pd) coating layer in countless dots.