A general strategy of in-situ warpage characterization for solder attached packages with digital image correlation method

Abstract Recently, 3-D Digital Image Correlation (DIC) is widely applied to the reliability analysis of electronic packages, which particularly characterizes the in-situ deformation of ball grid array (BGA) packages. During the image correlation procedure, many parameters influence the accuracy and data integrity of measurement result. Facet (subset) size is the principal parameter and has been studied with much effort. However, the solder balls, which are built on the substrate surface, make the scenario different with the conventional 3-D DIC experiment for the planar samples. The undulant surface generates more obstacles for the successful image correlation. In order to summarize an effective solution of 3-D DIC measurement method for solder balls attached packages, camera angle, facet size and facet step are studied with different BGA packages and different stereoscopic camera systems to achieve the best correlation quality. Also, a novel surface treatment method is introduced to guarantee the surface speckles are generated uniformly on the fluctuant surface.