Robustness of pressure sensors with piezoresistive nanogauges up to 522 °C

Abstract This paper examines the robustness of pressure sensors fabricated with the M&NEMS technology at high temperature for industrial applications. Thermal cycling up to 522 °C showed good reproducibility of results. Comparison of sensor sensitivity before and after thermal cycling was very satisfactory with a variation in the range of 4–5%. The wafer level packaging of the sensor withstands very well these temperatures and it can be improved even further by changing the metallization of the pads in order to achieve even higher temperatures.