Hybrid Opto-electro-Mechanical Integration Technologies Based on Free-space Optics

With the development of micro process and micro analysis,macro eletromechanical systems or optical systems have already been minimized and somewhat integrated. However,since optical components and optical systems put critical requirements on material properties,geometry size and surface quality of microstructures,the miniaturization and integration of optical systems,especial free space optical systems are still a technological challenge. In this paper,an integration technology based on surface imprinting and bulk molding is proposed for free space optical systems. This technology realizes the miniaturization of optical parts and the optical interconnection of in layer or out of layer,based on which,the on-chip hybrid opto-electro-mechanical integration can be realized by combining micro-electro-mechanical system (MEMS) technology,printing circuit board (PCB) technology with surface mounting device (SMD) technology.