Characteristics Study of Die-Bond Process of High-Power LED Package

High-power light-emitting diodes (LEDs) are essential in general lighting applications. Because of the characteristics of semiconductors, the optical and electrical properties of LEDs vary with the operating temperature. To increase the reliability of high-power LEDs, this study conducted a shear stress test and examined the thermal dissipation alongside electrical and optical properties. The simulated and experimental trends of the thermal distribution of the LED package overlapped effectively. The results revealed that changing the side glue height from 10% to 100% of die height, which consequently increases the shear stress of 1693 g/mm 2 , reduces the thermal resistance of 1 °C/W, and reduces the luminous flux of 0.4 lm, can optimize the LED reliability.