Compact Mems Thermal Wind Sensor Using Dual Polysilicon Layers with Improved Accuracy

In this paper, a compact MEMS thermal wind sensor with dual polysilicon layers is proposed for the first time. The novelty of this device is that four heaters and four thermistors are placed vertically instead of lateral arrangement in traditional sensors. This method makes the temperature of the heaters and corresponding thermistors approximately equal when working in the temperature-balanced mode. Fabricated using MEMS techniques, the sensor chip occupies 3×3mm2. Based on the novel design, the experimental results show that improved measurement accuracy up to 33 m/s is achieved with speed error of less than ± 0.5 m/s and direction error of less than ± 2°.