New Polymers for Emerging Interconnection Applications

The principal drivers for the development of new polymers for electronic applications include: device, substrate and system miniaturization impacting operational speed and product weight (e.g. portability), coefficient of thermal expansion (CTE) mismatch of semiconductor and related packaging and interconnecting materials, increase in data signal processing speeds and need for dielectric constant (e′) and dielectric loss (e″) reduction, integration of low cost, production efficient, high performance materials and enabling technologies into consumer products, improved product reliability.