Wafer-Level GlassCapping asDrop-in forMiniaturized, Advanced Optical COB Packaging

The novelwafer-level packaging (WLP) process described inthispaperallows quasi-hermetic capping of optical devices onwafer-level yielding miniaturized glass cavity windows ontopoftheoptical area, atthesametime leaving thecontact areaaccessible forstandard electrical connections i.e. wirebond.Thesesmaller chip-size optical cavity packages areusedwithin standard chip-on-board (COB)assemblies forhighperformance optical applications providing highyield andutmost reliability. Inthis paper theprocess flowofgenerating optical cavity glass wafers aswellasofthewafer-level capping process is demonstrated andreliability data onwafer-level andpackagelevel arediscussed.